Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process - ScienceDirect
Figure 2.6 from Pressure dependence of the SnP phase diagram and investigations in the ternary system | Semantic Scholar
SEM images of the Ni-Sn interface and the developing IMC at a... | Download Scientific Diagram