F0480 Datasheet
AN1902, Assembly Guidelines for QFN (Quad Flat No-Lead) and DFN (Dual Flat No-Lead) Packages - Application Note
AN1902: Assembly guidelines for QFN and SON packages – Application Note
QFN Component Package | mbedded.ninja
Recommended Land Pattern for QFN 4.0x4.0 24 Lead
Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability
Proto Advantage - LFCSP-28 to DIP-28 SMT Adapter (0.8 mm pitch, 7 x 7 mm body)
Proto Advantage - LFCSP-28 to DIP-28 SMT Adapter (0.5 mm pitch, 5 x 5 mm body)
QFN Component Package | mbedded.ninja
Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface-Mount Guidelines for Leadless Packages
AN005e: IC Package / PCB Footprint Guidelines - QFN28 5x5
AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) | Analog Devices
Design Guidelines for Cypress Quad Flat No-lead (QFN) Packaged Devices
56-Pin Quad Flatpack No-Lead Logic Package
AN1902, Assembly Guidelines for QFN (Quad Flat No-Lead) and DFN (Dual Flat No-Lead) Packages - Application Note
FTDI Example IC PCB Footprints
MySolidWorks - Official SOLIDWORKS Community
Solder Paste Stencil Design for Optimal QFN Yield and Reliability
Proto Advantage - LFCSP-28 to DIP-28 SMT Adapter (0.5 mm pitch, 5 x 5 mm body)
AN1902, Assembly Guidelines for QFN (Quad Flat No-Lead) and DFN (Dual Flat No-Lead) Packages - Application Note
Solder Paste Stencil Design for Optimal QFN Yield and Reliability
Pcbnew Footprint Wizard - QFN troubles
AN-772, A Design and Manufacturing Guide for the Lead Frame ...
QFN Layout Guidelines
