Experimental Determination of the Sn-Cu-Ni Phase Diagram for Pb-Free Solder Applications
Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders | Journal of Materials Research | Cambridge Core
Cu-Ni-Sn: A Key System for Lead-Free Soldering
Experimental Determination of the Sn-Cu-Ni Phase Diagram for Pb-Free Solder Applications | SpringerLink
Cu–Ni–Sn–Si alloys designed by cluster-plus-glue-atom model - ScienceDirect
Metals | Free Full-Text | Experimental Investigation of the Ti-Nb-Sn Isothermal Section at 1173 K
Cu–Ni–Sn isotherm phase diagram at 240 °C based on the previous works... | Download Scientific Diagram
File:Cu-Sn phase diagram.jpg - Wikimedia Commons
Microstructure and chemical characterization of the intermetallic phases in Cu/(Sn,Ni) diffusion couples with various Ni additio
An enlarged Sn corner of the isothermal section of the Sn- Cu-Ni... | Download Scientific Diagram
Experimental Determination of the Sn-Cu-Ni Phase Diagram for Pb-Free Solder Applications | SpringerLink
inorganic chemistry - Ag-Sn-Cu Phase diagram to formulate homogenization temperature / duration - Chemistry Stack Exchange